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Bachmann Electronic unveils third-generation MX200 modules

Bachmann Electronic will unveil the third generation of its MX200 processor modules at SMM 2026. The compact modules are designed for control tasks in the marine and port sectors, including power management and vessel control.

The new generation is based on Intel industrial CPUs combined with the VxWorks 7 real-time operating system, providing deterministic performance for demanding control applications.

An integrated TPM 2.0 chip provides hardware-based cryptographic functions, supporting secure key management. A microSD slot allows additional storage capacity and can also be used as a boot device, offering greater flexibility for system configuration and maintenance. Up to two integrated CAN bus interfaces provide connectivity to industrial fieldbus and control networks.

The fanless modules are designed for operation in temperatures ranging from -30°C to +60°C. An integrated power supply feeds both the control unit and the connected I/O system, allowing complete base systems to be built within two module widths. According to Bachmann Electronic, this enables space-saving installations, particularly where installation space is limited.

The modules also feature communication interfaces including Ethernet, CAN and USB 3.0 for data transfer. They offer up to 4 GB of onboard storage for applications and data, together with up to 1 GB of LPDDR4 memory for more demanding control applications.

Hall B6, Booth 307

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